However, inside tungsten carbide usually contain some grease, which is not easily to be cleaned. And in the process of electro-deposition pretreatment, it will penetrate into plating solution, which resulting in the coating pan-point corrosion from the inside out, so that the final coating falls off. Compared with copper plating on other materials, tungsten carbide has higher requirements on degreasing. Commonly used methods of electrolytic degreasing, heat degreasing and organic solvent degreasing, and the heat degreasing is the best choice for tungsten carbide. It should be polished after degreasing, and remove the oxide layer on the surface and then wash by ionized water ultrasonic.

In pre-plating process, we use cyanide copper, and electroplating of copper sulfate usually used as the plating solution, the temperature controlled at about 20 ℃, air agitation, anode copper (copper) plating time is about 5-10min. Finally, we make a comprehensive assessment of coating from the appearance, the hardness and the bonding strength. From the appearance of the copper layer surface is smoother and surface roughness of less than 0.3μm. Compared with the coating without pretreatment or high-temperature degreasing, it has higher density and there is no peeling, cracking or shedding. The hardness of Cu plating layer on tungsten carbide can reach 216-219HV. Bonding strength test method can be divided into two types, one is heating, which heat the plated workpiece to 300℃ and hold 1h, quickly removed and placed in water at room temperature to observe whether the coating peeled or shed; the other is scribing, was 30 ° with the edge of the cutting carbide layer again designated as the side length of 1mm squares, and observation of the coating peeling off phenomenon.

In addition, the carbide deposition process for copper plating is a mechanical process of accumulation, due to copper and tungsten carbide WC and Co in the substantial absence of mutual penetration and dissolution, is a combination of mechanical way. After coating the hydrogen plasma treatment, the elements Cu and carbide matrix was dissolved in each other at the joint surface, diffusion, thereby forming an interface diffusion layer. The existence of this diffusion layer will make the combination of copper layer and cemented carbide substrate metallurgical bonded to shift from mechanical binding, thus combining the strength of the copper layer and the cemented carbide substrate has been significantly improved.

Theoretically, deposit a diamond layer on tungsten carbide cutting tools by using CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition), which can be remarkably improve the properties of tungsten carbide. But the most common problem is the match of thermal performance and the binding force between cemented carbide substrate and the coating layer. So the researchers find that applying a layer of transition between the coated film and the cemented carbide substrate can significantly improve the performance of the film base. It refers to plating a metal layer on tungsten carbide cutting tools, which is the new attempt used electrodeposited layer as transition.

Cu has good wettability on diamond tools and in the CVD diamond deposition process, the Cu plating layer is almost not affected by the temperature, which is one of the ideal transition layer materials. The basic process of copper plating on tungsten carbide cutting tools: workpiece fabricating → pretreatment → washing → pre-plating → electroplating → washing. Since the most of the products are made of cemented carbide WC, TiC and other metal carbide and a binder composed of Co and prepared by powder metallurgy method, so there are some pores and defects between the grains, which means the corresponding pretreatment process for tungsten carbide coating layer is crucial. In order to remove the oxide layer on tungsten carbide surface, we usually choose pickling method. But this will lead to the shedding of small amount of Co on the surface and increase the pores on the surface. And the corresponding loss of Co binder role carbides will more easily expose to fall off so that the binding property of the coating is significantly reduced.

Tungsten alloy beta radiation source shielding can be used for shielding beta radiation released from the use or preparation of beta radiation source with its great radiation shielding ability. Beta radiation source , also referred to as beta source, is a radiation source with the main characteristics as emitting beta particle of it, that can be used to test the thickness and density of a item(such as a paper), and conduct the clinical surface treatment. It can be prepared by radionuclide, such as  T, 14C, 22Na, 58Co, 63Ni, 85Kr, 32p, 90Sr, 90y and 147pm, etc. when radionuclide decays, the nucleus would be transformed into another nucleus by emitting electrons and neutrinos, and releasing large amounts of beta particles. Beta particles can be used for treating health conditions such as eye and bone cancer and are also used as tracers.

Beta particles are a type of ionizing radiation which can produce radiation. Being composed of charged particles, beta radiation is more strongly ionizing than gamma radiation, and more strongly penetrating than alpha radiation. Beta radiation is able to penetrate skin to cause radioactive damage. Once it into the human body, it can change the structure of struck molecules and chemical equilibrium of the cells. In most cases, such change can be considered to be damage, with results possibly as severe as cancer or death. If the struck molecule is DNA, it can cause spontaneous mutation, fetal malformation, congenital leukemia. Therefore, it is need to use a tungsten alloy beta radiation source shielding to shield and absorb the beta radiation, in order to effectively prevent people using or preparing the beta radiation source from radiation damage.

Tungsten alloy beta radiation source shielding is made of tungsten alloy. It has a great radiation shielding effectiveness, so that can shield and absorb radiation in a high degree. Tungsten alloy is a tungsten-based alloy joining other elements, for its high density, high melting point, high temperature strength, good creep resistance and good electrical conductivity, it is widely used in a lot of fields. Compared to traditional radiation shielding materials such as lead and boron carbide, tungsten alloy radiation shielding provide excellent density with small capacity. At the same weights high density alloy can provide the same energy absorption as lead using 1/3 less material. Thus, tungsten alloy shielding is the best choice.

Related industries also put forward some standards for tungsten boat for semiconductor device, such as test methods, inspection rules, marking, packing, transportation and storage and other aspects.

After the preparation of the tungsten boat, it should be transported through strict inspection standards. Firstly, the test batches of the product must be the same types which have the same ingredients and produced in the same production process. When test products, people should test them seriously in accordance with the standards to ensure that products meet in all aspects of the standards requirements. Within two months of receipt of the product, the demand side should check products in accordance with the standards. If there exist some problems which do not meet the standards, customers can communicate with suppler.

The inspection for chemical composition of tungsten boat must be analyzed in the chemical composition of a sample in each batch of material. In the case of non-compliant, then the docimaster should analyze chemical composition of the sample, and then averaging it. If it still cannot meet the standards, it is determined that this batch of tungsten boat unqualified. Tungsten boat density test can be taken the same way to the test of the chemical composition. Tungsten boat specifications and surface quality should be one hundred percent inspection.

When packing the qualified tungsten boat. Every 10 wrapped in brown paper, in order to prevent the tungsten boat surfaces from being scratched or breaking. Then ut it into a plastic bag, 20 bags for a box, 4 boxes for a wooden case. Shock-proof scraps of paper should be filled with wooden case, and finally pack it up with iron sheet which can reinforce the wooden case. Inside the packaging boxes of products, material name, batch number, size, quantity, imprint of inspection department, inspectors stamp, date of production and name of the manufacturer should be indicated. Outside the packaging boxes of products, the name of the manufacturer, product names and specifications, quantity, and date of manufacture should be indicated.

In transit, pay attention to handle it. Although there are shock-proof scraps of paper in wooden case, but it still needs to prevent the product from being squeezed, crashed. Before shipping, it is better to have knowledge about the weather conditions, in case rain and snow which would cause product get cold. Therefore, the wooden cases should be place in a dry and ventilated shelves, the relative humidity must less than 65% without any alkalis, acids and other harmful gases.

Tungsten boat is formed by tungsten sheet through high-pressure tungsten which has a good electrical conductivity, so it is widely used in kinescope, mirror making, toys, household appliances, mobile phones, electrical enclosure and other electronics industries. In recent years, tungsten boat for semiconductor devices has also been given considerable attention by the public. Semiconductors are crystalline or amorphous solids with distinct electrical characteristics, using special electrical characteristics to complete the specific functions of electronic device. Therefore, related industries develop the relevant standards for tungsten boat for semiconductor devices. The followings include brands, models, specifications, technical requirements, test methods, inspection rules, mark, packing, transportation and storage.

Grades of tungsten boat can be named as WZO in according with the chinese phonetic alphabet "wolfram" and "boat". Tungsten boat models can be express as "V" and "U", different types of each model use the Roman numerals Ⅰ, Ⅱ, Ⅲ to represent. Tungsten boat specifications should be express in number in the format "- the wall thickness of the boat - the boat width." Applications should correspond to the marks and models. For example, WZO-V-Ⅰ-02-17, its brand is represented by WZO, V-type non-pressure side with 0.3mm tungsten boat wall thickness, 15mm tungsten boat width. Except that, the surface quality of tungsten boat should always keep in a clean condition, the color is silver-white metallic luster without any cracks, stratification, lack of edge and other defects. All parts of the tungsten boat cannot have glitches. Performance of tungsten plate used by tungsten boat should accord with the national GB3875 requirement. Using the accuracy of 0.02mm caliper and 0.01mm micrometer to measure tungsten boat size, according to national standard GB4196 tungsten boat standards. The weight of tungsten boat should be weight in a balance with a 0.2g sensibility of balance. If the chemical composition of tungsten boat is qualified, it is no need for measuring the melting point.

With the rapid development of tungsten boat for semiconductor devices, the threat of environmental pollution of tungsten boat is also rising. Tungsten compounds such as tungsten carbide dust, tungsten oxide, tungsten carbide, and tungsten boat have a great impact on health which would cause inflammation of eyes or skin and some respiratory diseases such as asthma, if people deal with it for a long time.