3D NAND Flash Particles of Solid State Disk Capacity Up to 2T
- Category: Tungsten Information
- Published on Thursday, 05 October 2017 11:09
In 2017, IT is a big event in the hardware industry, in addition to the issue of new Intel processor AMD war, is the memory, solid state disk prices across the board.
The flash memory is a nonvolatile memory that can store the data that has been written in the case of power failure, and is based on a fixed block as a unit, rather than a single byte as a unit of life, our mobile phone memory, computer memory, SSD, and even U disk are flash memory.
NAND is a flash, the Hitachi company in 1989 to develop and market, because the NAND flash particles with lower power consumption, lower price and better performance and many other advantages, is mainly used for manufacturing solid state disk. At present, the main manufacturer of flash particle is Samsung, Toshiba, SanDisk, Intel, SK Hynix and six micron, they occupy a market share of 90%.
It is said that the SSD skyrocketing from Samsung and Toshiba to upgrade 2D NAND flash. For many years, 2D NAND has been the driving force of lithography in semiconductor industry, however, as the physical limit of the wafer is approaching, the flash memory particles that can be loaded inside the single storage unit of the solid state disk are approaching the limit, each unit becomes very small, and the capacity of the single disk is approaching the limit.
So the industry put forward the concept of 3D NAND, using memory particles, in the same size, greatly improves the capacity and volume of the flash disk, and further improves the total capacity of the storage particles. Samsung has developed a process called Terabit Cell Array Transistor (TCAT). TCAT is a gate-last approach, the deposits are alternating oxides and nitrides. A channel through these layers is then formed and filled with oxide nitrides, oxides, and polysilicon. Then form the ladder. Finally, a groove through these layers is etched and the nitride is removed. Then, the alumina (AlO), titanium nitride (TiN) and tungsten (W) are then etched back (etch, back), and finally the groove is filled with tungsten.
3D NAND not only improves the response speed of the memory particles, also significantly enhance the capacity of solid state disk space, in the technical innovation of 3D NAND, Samsung SSD single disc capacity upgrade to 2T, sold to nearly a million. According to the price trend of electronic products, after upgrading, the old products will often usher in a wave of price cuts, so the market price of solid-state hard disk will soon drop back.
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