Zirconium Tungstate Enhance Electronic Packaging

Epoxy resin E-51 is a kind of epoxy oligomer, which has higher content of epoxy resin and many kinds of curing agent. It reacts with curing agent to form thermosetting plastics with three-dimensional network structure.

It has become the main material in the field of electronic packaging because of its dimensional stability, low water absorption, adhesion, heat resistance, chemical resistance, and excellent electrical performance. However, people in the production found that E-51 cured packages are prone to crack, package cracks, voids, passivation and delamination.
 
The resin’s characteristic of expand with heat and contract with cold leads to a large difference in the coefficient of linear expansion between the E-51 resin package and the electronic component, thus causing the occurrence of the above phenomenon.

Difference of coefficient of linear expansion between E-51 resin and electronic component leads to thermal stress in the package during operation. And with the wear and tear, products appear strength decline, heat shock and other issues. Over time, cracks, voids, passivation and delamination appear.

In view of the above problems, some scholars have tried to add zirconium tungstate material with negative thermal expansion property to E-51 to prepare zirconium tungstate epoxy resin encapsulation material to strengthen electronic packaging,

During the experiment, bisphenol A type epoxy resin (E-51), promoter 2,4,6-, trimethylamine methyl phenol (DMP-30) and curing agent, titanic acid three, isopropyl alcohol tertiary amine ester (706) and zirconium tungstate (nanometer level 0.6 mu m) are mixed at a temperature of 60℃. After 30 min (10-1Pa， 60℃) of vacuum defoamation, the mixture is put into the oven, curing by a certain heating curing program. The ZrW2O8/E-51 composite is prepared by stripping and cooling off the internal heat after the furnace is cooled.

The results show that the use of ZrW₂O₈/E-51 composites for electronic packaging reduces the coefficient of linear expansion and increases the hardness of the material. Compared to a single E-51, it has better adhesion, heat resistance, chemical resistance and electrical properties. After the strengthening of zirconium tungstate, the products of electronic packaging have been basically free from cracks, voids, passivation and separation, and the quality of the products is even higher.

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