Gold-plated tungsten copper heat sink material is a kind of composite material, which combines the advantages of copper and tungsten. It has high strength, high specific gravity, high temperature resistance, good electric and good processability.

As the heat sink material, gold-plated tungsten copper has low expansion of tungsten and high thermal conductivity of copper. More important is that the thermal expansion coefficient and thermal conductivity can be tailored by adjusting the composition of the material properties, which bring great convenience to heat sink materials. In the fields of microwave packaging and RF packaging, it also always uses that material as heat sink. In military electronic equipment, it is often used as the base material of highly reliable circuit boards.

 

 

Microelectronic packaging materials, an important component of electronic components, provide a solid foundation for the improvement of electronic component performance and normal operation. The electronic component is an important foundation of the information industry. Microelectronics is the core technology, and packaging, design and wafer manufacturing has become the three components of microelectronic technology.

 

In the semiconductor microwave power device packaging, tungsten copper electronic packaging material has excellent thermal conductivity and adjustable thermal expansion coefficient, which is the preferred packaging material for high power electronic components both at home and abroad. It can have a good thermal expansion match with ceramic materials, semiconductor materials, metal materials. It’s widely used in microwave communication, radio frequency, aerospace, power electronics, high power semiconductor laser, and medical, etc.

 

High density packaging has become the direction of electronic technology. With the increase of the integration degree of silicon chips and other components, the power load per unit area is becoming larger, and the thermal conductivity and thermal expansion coefficient matching are becoming more important. Tungsten copper material not only has high thermal conductivity, but also its coefficient of thermal expansion matches well with semiconductor materials like silicon. Besides, it has excellent high temperature resistance, good processability, moderate density and  tightness, which make it has wide applications.