In addition, due to the diffusion of crystal grains, the odds of the liquid copper into the tungsten particles increases, the lattice stress decreases, and the tungsten particles are rearranged so that the partial so that the construction is more uniform. Viewed from the cost, it is useless to increase infiltration time.

In the early of infiltration, tungsten skeleton was not completely infiltrated by copper solution, which lack of density and hardness. However, the infiltration has become more and more fully as time goes by so that the density and hardness of tungsten copper electrode will rise. But when infiltration is completely and time continue to increase, it may lead tungsten particle to grow up and evaporated tungsten particles in liquid copper, which makes tissue distribution is uneven, the hardness decreased accordingly. Except that the density and hardness of tungsten copper electrode, the electrical conductivity is also an crucial property when it used as electrode in EDM or ECM.

More infomation about infiltration time effect on tungsten copper electrode properties, click here:

http://news.chinatungsten.com/en/tungsten-information/80929-ti-10426

Take W-Cu tungsten copper electrode as an example, with increasing infiltration time, the density of tungsten copper electrode increases. And after that the infiltration density reaches the maximum, the density of tungsten copper electrode decreases by the time. The density and hardness of tungsten copper W-25Cu in different infiltration time as follow:

In the process of infiltration, copper solution completely infiltrated tungsten skeleton will take some time, with the increasing infiltration time, tungsten skeleton has infiltrated more fully, the corresponding density of tungsten copper electrode was improved. However, when tungsten skeleton was completely infiltrated by copper solution, if the temperature continues to increase the infiltration density changed a little longer this time but likely to cause the liquid copper tungsten particle erosion, some places inside may appear copper pool, which decrease the density of tungsten copper electrode.

In addition, before reaching optimum infiltration temperature, tungsten particles are distributed more evenly, but copper infiltration is not very uniform, after which the temperature rises, copper dissolution, infiltration sufficient. And the infiltration temperature is too high, tungsten particles connections increased risk, the smaller the tungsten particles grew up together, the copper phase distribution network has been hampered, leading to uneven distribution organization.

Overall, the properties of tungsten copper electrode react sensitively to infiltration temperature, which affected by wetting angle, surface tension, viscosity, capillary force, particle rearrangement, solid phase sintering, liquid phase sintering, particle distribution, coupling rate and so on. Therefore, infiltration temperature plays an important role in tungsten copper electrode properties.

More information about infiltration temperature effect on tungsten copper electrode properties, click here:

http://news.chinatungsten.com/en/tungsten-information/80856-ti-10414 
http://news.chinatungsten.com/en/tungsten-information/80857-ti-10415 
http://news.chinatungsten.com/en/tungsten-information/80908-ti-10421

However, with the increasing infiltration temperature, tungsten skeleton sinter in solid phase, which blocks up the rearrangement of particle during the infiltration of copper liquid. The increasing close pores decrease the density of tungsten copper electrode. When the temperature exceeds the limit, tungsten particles will have sintering aggregation. Meanwhile, in the process of infiltration, the surface tension of liquid copper was plummeting copper liquid by capillary force is reduced, resulting in copper liquid overflow.

The hardness of tungsten copper W-25Cu at different infiltration temperature:

The graph shows that the hardness trend is similar to the density trend of tungsten copper W-25Cu, which increases with the increasing temperature at the beginning, and decreases when the temperature exceeds the limit. Due to the hardness of tungsten-copper alloy essentially depends on the density of tungsten copper alloy, for tungsten copper infiltration, before reaching the best temperature, the density of tungsten copper electrode will increase.

Tungsten alloy(90%W4%Ni45Mo2%Fe) similat to Anviloy 1150 material is used in electrobrazing applications where head balance is important. The tungsten lloy similar to  Anviloy 1150 material also has good anti-sticking qualities and good high temperature abrasion and hardness properties. The oxidation resistance of both material is excellent up to 1100F.

Features:

High temperature resistant capability

Robust external and internal body

Good thermal conductivity

Better surface finish

Corrosion and heat resistance

Ruggedness

Shock resistant capability

Environment friendly

高比重合金供应商：中钨在线科技有限公司	产品详情： http://www.tungsten-alloy.com
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Tungsten heavy alloy similar to the brand name as Anviloy 1150 is a tungsten-based material with adding a few amount of molybdenum, copper, nickel, iron. With low coefficient of thermal expansion, good thermal conductivity and good material properties,  tungsten alloy similar to anviloy 1150 can have less thermal fatigue and soldering in the die cast or extrusion.When the mold has to repeatedly withstand the metal melt at a temperature of over 600℃, we will offer tungsten heavy metal alloy similar to Anviloy 1150 or for your choice.

We will supply tungsten alloy similar to Anviloy 1150 mold inserts, sprue bushes, cooling inserts and other individual parts for die casting, aluminum permanent mold, and difficult extrusions.

高比重合金供应商：中钨在线科技有限公司	产品详情： http://www.tungsten-alloy.com
电话：0592-5129696 传真：5129797	电子邮件：This email address is being protected from spambots. You need JavaScript enabled to view it.
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Infiltration temperature controlling is crucial in the process of tungsten copper electrode, its rise and fall has a great effect on comprehensive performance of tungsten copper electrode. There is a graph of the relation of infiltration temperature and wetting angle as follow.

The graph remarkably shows that infiltration temperature plays an important role in diffusion effects. The higher Infiltration temperature, the smaller the infiltrate angle, easily viewed from the figure, the wetting angle decreases with increasing temperature, the surface tension increases with increasing temperature. Theoretically, when the temperature is 1350 ℃, θ = 0°, completely molten copper and tungsten wetting at this time, the infiltration effect is best. And the copper liquid viscosity decreases with increasing temperature, so the temperature can be increased to improve the infiltration of liquid copper flowability, enhanced capillary action, be conducive to infiltration.

More information about infiltration temperature effect on tungsten copper electrode properties, click here:

http://news.chinatungsten.com/en/tungsten-information/80856-ti-10414