With the high power of electronic components and more stringent working conditions, the uniform W-Cu heat sink material is difficult to meet the requirements of heat dissipation. Therefore, it is considered to be an effective way to solve this problem by developing the tungsten copper heat sink material which is formed along the thickness direction.

Tungsten copper composite is one of the most widely used heat sink materials at present. It is made up of high conductivity copper and refractory metal tungsten. They neither dissolve each other nor form intermetallic compounds, so they are also called pseudo alloys. Tungsten copper composites are used in large scale integrated circuits and high power microwave devices as electronic packaging materials and heat sink materials, such as substrate, connector and heat sink.

Plasma spraying, also known as thermal spraying method, is the use of plasma arc generator will be introduced into the nozzle gas heating and ionization to form a high-temperature high-speed plasma jet, metallic or non-metallic materials are melted and atomized and sprayed at high speed onto the pre-treated workpiece surface to form a coating.

Silver based antibacterial materials have been widely used as antibacterial agents because of their advantages of broad spectrum, safety, heat resistance and durability. The traditional concept is that silver materials have greater advantages in antibacterial than non silver materials.

Silver tungstate, as a member of the functional tungstate system, is applied in biological, pharmaceutical, catalytic, environmental protection, electrode materials and other important fields because of its special functional transition metals.

For a long time, TiO₂ has been the preferred material for photocatalysis. Until 1983, Chinese scholars used WO₃ to deal with printing and dyeing wastewater for the first time, and achieved very good results. Tungstate has narrower forbidden band width (2.8eV) than TiO₂. It is considered to be one of the most potential photocatalysts.