Tungsten nitride is a kind of material more popular in tungsten chemicals, some studies show that tungsten nitride is a new catalytic material, the surface properties and catalytic properties similar to platinum, tungsten nitride catalyst application can avoid the pollution caused by industrial catalyst sulfur vulcanization, therefore it has broad application prospects. Moreover, tungsten nitride is also a ceramic material with excellent mechanical and thermal stability. For these two applications, nanoscale tungsten nitride will have a significant advantage.

Tungsten has high melting point, high hardness and other excellent performance, copper has good electrical conductivity. W-Cu composites composed of tungsten and copper have good thermal conductivity, electrical conductivity and low thermal expansion coefficient. At present, W-Cu composites are used in large scale integrated circuits and high-power microwave devices as electronic packaging materials and heat sink materials such as substrates, connectors and heat dissipation parts. 

Tungsten copper composite is one of the most widely used heat sink materials at present. It is made up of high conductivity copper and refractory metal tungsten. They neither dissolve each other nor form intermetallic compounds, so they are also called pseudo alloys.