Metal oxides play a key role in the development of many advanced functional materials and smart devices. Among many metal oxides, tungsten trioxide (WO₃) is a unique material. It is a N-type semiconductor with a wide range of crystal forms, band gap of 2.5-2.8eV, and has visible light response characteristics. Therefore, WO₃ can be used as light sensor devices, such as photochromic devices and transparent electrodes; at the same time, WO₃ can also be used as visible light photocatalyst, using photodynamic degradation of organic pollutants and heavy metal ions in sewage, which is environmentally friendly and economical; in indoor environment detection, WO₃ can be used as a gas sensor.

The surface morphology, microstructure and particle size of cast tungsten carbide have a decisive influence on its application effect. Spheroidizing and rapid cooling of traditional cast tungsten carbide powder can significantly improve the toughness of hard surface materials containing cast tungsten carbide, and achieve the best combination of high wear resistance and high toughness of hard surface materials.

Tungsten copper embedded block is manufactured by powder metallurgy, which is a kind of typical sweating material. Even if at high temperature (3000℃), the copper evaporation will take away the most part of heat and effectively reduce the surface temperature and keep the strength. In addition, it has perfect conductivity and plasticity, which is beneficial for improving the mechanical properties of the embedded part.

Tungsten copper disk is pseudo-alloy between tungsten and copper. It has the thermal stability of tungsten and good electrical conductivity of copper. Because different of melting point between tungsten and copper, we can use traditional casting process to manufacture the tungsten copper alloy.

Tungsten copper block is also called tungsten copper plate, and commonly used are w80 tungsten copper plate and w85 tungsten copper plate. Tungsten copper block is often used in spark electrodes, which have the electrical and thermal conductivity of copper and the high hardness and arc ablation resistance of tungsten. Tungsten copper block is used in the production of electric sparks. Vacuum sintering is usually used to make tungsten and copper have good physical and chemical properties.

Tungsten copper foil is a pseudo-alloy composed of high-melting-point high-strength tungsten and high-conductivity and heat-conducting copper. It is widely used because of its good corrosion resistance, fusion resistance, high strength and high hardness. As electrical contact materials, plasma electrode materials, military materials for high temperature use, heat sink substrates and packaging materials.

Tungsten copper slab with the properties of tungsten’s high strength, high stiffness, low thermal expansion coefficient and copper’s high plasticity, good electrical and thermal conductivity and other properties. In large scale integrated circuits and high-power microwave devices, tungsten copper alloy material as the substrate, the slug, connectors and cooling components have developed rapidly.

Tungsten carbide particles have a series of advantages, such as chemical stability, high hardness, almost comparable to the hardness of diamond, and extremely high wear resistance. The bonding strength between deposited tungsten carbide particles and Ni-P coatings will affect the performance of the composite coatings. Therefore, improving the bonding strength between coating and matrix and the bonding between deposited tungsten carbide particles and nickel phosphorus cells and avoiding the falling off of deposited particles become the key to ensure the effectiveness of composite coating.

Tungsten powder is widely used in cemented carbide, tungsten products, chemical industry and steel industry. Tungsten powder is used as raw material for cemented carbide products and other tungsten products. Its particle size and size distribution have an important impact on product performance.

Because tungsten can form soluble heteropoly acid (such as [PW₁₂O₄₀]₃^-) with impurities such as phosphorus, arsenic and silicon at the ratio of 1:6 to 1:12, a small amount of phosphorus can cause a large amount of tungsten dispersion and loss in the process of hydrochloric acid decomposition, so hydrochloric acid decomposition process mainly deals with high-grade Scheelite Concentrate (requiring low impurities such as phosphorus and arsenic).